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Plasma Processing
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STS ICP Dry Etch Tool

The JWNC has comprehensive dry etching and deposition capabilities which includes equipment for in situ monitoring of plasmas and etch depth plus tools to measure the refractive index and thickness of films. The facility contains 5 reactive ion etch machines (including Oxford Instruments System 100 and 80 plus), 2 inductive coupled plasma RIE tools (including STS ICP RIE, Oxford Instruments System 100 ICP 180) and 3 PECVD systems (including Oxford Instruments System 100 and 80 plus).

For a summary of materials etched/deposited and system details please follow links on right side of the page.

 

 
Lithography
Metallisation
Plasma Processing
Microscopy
Miscellaneous
Partner Facilities
 
 
Materials Etched/Deposited
System Details
 

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